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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2004.1
- 수록면
- 12 - 19 (8page)
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초록· 키워드
오류제보하기
Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours.
목차
Abstract
1.Introduction
2.Analysis
3.Experiment
4.Results and Discussion
5.Conclusions
Acknowledgment
References
참고문헌 (15)
참고문헌 신청
[학술지(정기간행물)] - / 1989 / Mechanical Properties of Thin Films 20a : 2217 ~ 2245
[학술지(정기간행물)] - / 2000 / Investigation of Residual Stresses in Microsystems Using X-ray Diffraction a288 : 119 ~ 125
[학술지(정기간행물)] - / 1996 / Mordern Techniques in Raman Spectroscopy
[학술지(정기간행물)] - / 1995 / New Optical Near Field Developments Some Perspectives in Interferometry 61 : 117 ~ 125
[학술지(정기간행물)] - / 1987 / Measurement and Interpretation of Stress in Aluminum-Based Metallization as a Function of Thermal History IEEE Trans. on Electronic Devices ed-34 : 689 ~ 699
[학술지(정기간행물)] - / 2000 / Investigation of Residual Stresses in Microsystems Using X-ray Diffraction a288 : 119 ~ 125
[학술지(정기간행물)] - / 1996 / Mordern Techniques in Raman Spectroscopy
[학술지(정기간행물)] - / 1995 / New Optical Near Field Developments Some Perspectives in Interferometry 61 : 117 ~ 125
[학술지(정기간행물)] - / 1987 / Measurement and Interpretation of Stress in Aluminum-Based Metallization as a Function of Thermal History IEEE Trans. on Electronic Devices ed-34 : 689 ~ 699
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UCI(KEPA) : I410-ECN-0101-2009-550-014052262