지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 1995.11
- 수록면
- 445 - 451 (7page)
이용수
초록· 키워드
오류제보하기
Evacuated powder insulations have long been known to exceed the thermal performance of existing commercially available insulators, such as fiber glass and CFC-blown foam.
Evacuated powder panel insulation consists of ultra-fine particle powders encapsulated at a low pressure in a thin, low conductivity gas permeation barrier. The powder provides a rigid support structure. The outstanding thermal performance is achieved by drastically reducing the effective thermal conductivity of the powder. This is accomplished by reducing the powder pressure, thereby minimizing the conductive heat transfer through the gas trapped in the void spaces between individual powder particles.
The present study investigates the feasibility of a composite panel: a series of individually evacuated panels incapsulated in a rigid closed cell foam matrix. The panels were encapsulated in a thin glass sheet barrier to preserve the vacuum.
Glass was chosen as the barrier material because it has a relatively low thermal conductivity and it is effectively impermeable to all gases. Low cost perlite powder was used, because, provided that low pressures are maintained within the panel by using a glass gas permeation barrier, it thermal conductivity is very similar to the thermal conductivity of other finer and more expensive powders, such as silica. The individual plastic-enclosed evacuated powder panels, encapsulated in a thin glass barrier, were put together in a matrix structure so that even if one individual panel is punctured or damaged, the insulating performance of the entire matrix is not significantly affected.
Individual powder panels were produced and tested. The thermal conductivity of the individual panel was found to be 0.0062 W/m^0K. The composite foam block with embedded vacuum panels achieved an overall thermal conductivity of 0.01656 W/m^0K for a 4.2 ㎝ thick composite block. The polyurethane foam above had a thermal conductivity of 0.024 W/m^0K.
Numerical analysis has indicated that by using low conductivity foam and more optimum vacuum panel geometries, much lower overall conductivities can be achieved.
Evacuated powder panel insulation consists of ultra-fine particle powders encapsulated at a low pressure in a thin, low conductivity gas permeation barrier. The powder provides a rigid support structure. The outstanding thermal performance is achieved by drastically reducing the effective thermal conductivity of the powder. This is accomplished by reducing the powder pressure, thereby minimizing the conductive heat transfer through the gas trapped in the void spaces between individual powder particles.
The present study investigates the feasibility of a composite panel: a series of individually evacuated panels incapsulated in a rigid closed cell foam matrix. The panels were encapsulated in a thin glass sheet barrier to preserve the vacuum.
Glass was chosen as the barrier material because it has a relatively low thermal conductivity and it is effectively impermeable to all gases. Low cost perlite powder was used, because, provided that low pressures are maintained within the panel by using a glass gas permeation barrier, it thermal conductivity is very similar to the thermal conductivity of other finer and more expensive powders, such as silica. The individual plastic-enclosed evacuated powder panels, encapsulated in a thin glass barrier, were put together in a matrix structure so that even if one individual panel is punctured or damaged, the insulating performance of the entire matrix is not significantly affected.
Individual powder panels were produced and tested. The thermal conductivity of the individual panel was found to be 0.0062 W/m^0K. The composite foam block with embedded vacuum panels achieved an overall thermal conductivity of 0.01656 W/m^0K for a 4.2 ㎝ thick composite block. The polyurethane foam above had a thermal conductivity of 0.024 W/m^0K.
Numerical analysis has indicated that by using low conductivity foam and more optimum vacuum panel geometries, much lower overall conductivities can be achieved.
목차
Abstract
Introduction
Panel Fabrication
Measurements
Results
Numerical Analysis
Conclusions
Reference
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