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논문 기본 정보

자료유형
학술저널
저자정보
이아름 (부산대학교) 조승재 (부산대학교) 박재현 (포항산업과학연구원) 강정윤 (부산대학교)
저널정보
대한용접·접합학회 대한용접·접합학회지 大韓熔接·接合學會誌 第29卷 第1號
발행연도
2011.2
수록면
99 - 106 (8page)

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Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

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Abstract
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2. 사용재료 및 실험 방법
3. 실험결과 및 고찰
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