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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.2
- 수록면
- 99 - 106 (8page)
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초록· 키워드
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Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.
목차
Abstract
1. 서론
2. 사용재료 및 실험 방법
3. 실험결과 및 고찰
4. 결론
후기
참고문헌
참고문헌 (20)
참고문헌 신청
1. [학술지(정기간행물)] - D. G. Kim / 2005 / Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-PUBM / MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY 121 : 204 ~ 210
2. [학술지(정기간행물)] - T. H. You / 2009 / Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading / JOURNAL OF ALLOYS AND COMPOUNDS 486 : 242 ~ 245
3. [학술지(정기간행물)] - F. Cheng / 2009 / Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability / Journal of Alloys and Compounds 472 : 530 ~ 534
4. [학술지(정기간행물)] - J. W. Yoon / 2010 / Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints / JOURNAL OF ALLOYS AND COMPOUNDS 506 (1) : 331 ~ 337
5. [학술지(정기간행물)] - Y.W.Lee / 2006 / A study on the spreadability of Sn-8mass%Zn-3mass%Bi solder with Au plating thickness / Journal of the institute of industrial technology 14 : 26 ~ 29
2. [학술지(정기간행물)] - T. H. You / 2009 / Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading / JOURNAL OF ALLOYS AND COMPOUNDS 486 : 242 ~ 245
3. [학술지(정기간행물)] - F. Cheng / 2009 / Interaction behavior between the additives and Sn in Sn-3.0Ag-0.5Cu-based solder alloys and the relevant joint solderability / Journal of Alloys and Compounds 472 : 530 ~ 534
4. [학술지(정기간행물)] - J. W. Yoon / 2010 / Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints / JOURNAL OF ALLOYS AND COMPOUNDS 506 (1) : 331 ~ 337
5. [학술지(정기간행물)] - Y.W.Lee / 2006 / A study on the spreadability of Sn-8mass%Zn-3mass%Bi solder with Au plating thickness / Journal of the institute of industrial technology 14 : 26 ~ 29
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UCI(KEPA) : I410-ECN-0101-2012-581-004322759