FIM(Film Insert Molding) is an innovative method of producing decorated parts for a wide range of products. As it incorporates fewer stages than conventional production methods, the time and cost of manufacturing high quality components can be reduced considerably. In this paper, the effects of processing conditions on warpage of film-insert molded plates were investigated by using design of experiments. The dominant factors of warpage were mold temperature and holding pressure. Warpage increased with the temperature difference between stationary mold and fixed one. Although the mold temperature difference was zero, the plate with film was bent after ejection such that the film side was protruded. As holding pressure increased, warpage decreased significantly. In addition warpage increased with time increment in the case of film-insert molded plates.