지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2012.5
- 수록면
- 306 - 309 (4page)
이용수
초록· 키워드
오류제보하기
In recent years, the demand for special semiconductors packages used in harsh operating environment is substantially increasing in various industries. Being as equally important as electrical properties in microelectronic packages, the reliability and stability issue of solder joints therefore has attracted considerable attention. Furthermore, rapidly diminishing ball pitch and size of a solder joint has been regarded as a potential reliability concern for its mechanical and physical properties. Nevertheless, few systematic studies have been devoted to the microelectronic package used under harsh environment such as in automobile, aerospace industries. This study suggests potential solutions for a solder joint of the next-generation semiconductor package under extreme operating conditions. A trace amount of B or Y is added to lead-free Sn-1.0Ag-0.5Cu solder to significantly improve its mechanical properties. The pull test result indicates that B, Y-doped solder joints can retain high fracture strengths, regardless of the aging time and reflow frequency.
목차
Abstract
1.서론
2. B-doped solder joints
3. Y-doped solder joints
4. 결론
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UCI(KEPA) : I410-ECN-0101-2014-550-002356712