메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
Pradeep Singh (National Institute of Technology) Shrish Verma (Indian Institute of Information Technology) O. P Vyas (National Institute of Technology)
저널정보
대한전기학회 Journal of Electrical Engineering & Technology Journal of Electrical Engineering & Technology Vol.9 No.5
발행연도
2014.9
수록면
1,739 - 1,745 (7page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
Prediction of fault-prone modules continues to attract researcher’s interest due to its significant impact on software development cost. The most important goal of such techniques is to correctly identify the modules where faults are most likely to present in early phases of software development lifecycle. Various software metrics related to modules level fault data have been successfully used for prediction of fault-prone modules. Goal of this research is to predict the faulty modules at design phase using design metrics of modules and faults related to modules. We have analyzed the effect of pre-processing and different machine learning schemes on eleven projects from NASA Metrics Data Program which offers design metrics and its related faults. Using seven machine learning and four preprocessing techniques we confirmed that models built from design metrics are surprisingly good at fault proneness prediction. The result shows that we should choose Naive Bayes or Voting feature intervals with discretization for different data sets as they outperformed out of 28 schemes. Naive Bayes and Voting feature intervals has performed AUC > 0.7 on average of eleven projects. Our proposed framework is effective and can predict an acceptable level of fault at design phases.

목차

Abstract
1. Introduction
2. Related Work
3. Metrics Description
4. Experimental Design
5. Results
6. Conclusion
References

참고문헌 (21)

참고문헌 신청

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2015-500-002560763