지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2014.11
- 수록면
- 1,485 - 1,488 (4page)
이용수
초록· 키워드
오류제보하기
In this paper, to enhance the adhesion between the copper pattern and flexible substrate, the silane coupling agent was added in the copper nano-ink with respect to the weigh fraction of silane. After then, the PI(Polyimide) substrate was treated by oxygen plasma. To investigate the effect of the plasma treatment, the AFM(atomic force microscope) were performed. Also, the copper pattern sintered by flash light was observed using SEM(scanning electron microscope). The adhesion test using the pressure sensitive tape was performed to measure the adhesion strength between the copper pattern and the substrate. The bending fatigue characteristic of copper pattern was also suggested. The change of the electrical resistance was measured during the bending fatigue test. It was found that the copper pattern containing 3wt% silane coupling agent exhibited the highest adhesion strength (5B) and lowest resistivity 24.5 μΩ?cm).
목차
Abstract
1. 서론
2. 실험
3. 결과 및 고찰
4. 결론
참고문헌
참고문헌 (0)
참고문헌 신청이 논문의 저자 정보
이 논문과 함께 이용한 논문
최근 본 자료
댓글(0)
0