메뉴 건너뛰기
Library Notice
Institutional Access
If you certify, you can access the articles for free.
Check out your institutions.
ex)Hankuk University, Nuri Motors
Log in Register Help KOR
Subject

Fabrication of 3D-Printed Circuit Device using Direct-Write Technology
Recommendations
Search
Questions

Direct Write 기술을 이용한 3DCD의 제작

논문 기본 정보

Type
Academic journal
Author
Hae Young Yun (안동대학교) Ho Chan Kim (안동대학교) In Hwan Lee (충북대학교)
Journal
The Korean Society of Manufacturing Process Engineers Journal of the Korean Society of Manufacturing Process Engineers Vol.15 No.2 KCI Accredited Journals
Published
2016.4
Pages
1 - 8 (8page)

Usage

cover
📌
Topic
📖
Background
🔬
Method
🏆
Result
Fabrication of 3D-Printed Circuit Device using Direct-Write Technology
Ask AI
Recommendations
Search
Questions

Abstract· Keywords

Report Errors
Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

Contents

ABSTRACT
1. 서론
2. 3DCD 시스템의 구성
3. 3DCD 크루즈 컨트롤 스위치 설계
4. 제작 및 실험적 검증
5. 결론
REFERENCES

References (8)

Add References

Recommendations

It is an article recommended by DBpia according to the article similarity. Check out the related articles!

Related Authors

Frequently Viewed Together

Recently viewed articles

Comments(0)

0

Write first comments.

UCI(KEPA) : I410-ECN-0101-2016-581-002764591