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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2019.2
- 수록면
- 76 - 81 (6page)
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In this paper, four types of solderable polymer composites (SPCs) with different reductant concentration (0, 7.5, 15 and 30 phr) were formulated to investigate the influence of reductant concentration within the SPCs on the coalescence and wetting behaviors of low-melting-point alloy (LMPA) fillers. Two types of wettability test including solder ball wetting (solder ball diameter: 760 ㎛) and solder powder wetting (solder powder diameter: 42 ㎛ and 30 vol%) tests were conducted. Additionally, to examine the chemical reactions of polymer composite depending on the reductant concentration, differential scanning calorimetry (DSC) analysis was conducted for the mixture of polymer and reductant. The LMPA fillers within the SPC with a reductant concentration of 15 phr showed excellent coalescence and wetting behaviors for the Cu metallization because of the favorable removal of surface oxide film on the LMPA fillers and metallization. Meanwhile, the selective wetting properties of LMPA with a reductant concentration greater than 15 phr showed decreasing tendency due to the shift of curing temperature to the low temperature range because of the increased chemical reaction between the reductant and epoxy. These results demonstrate that the optimal reductant concentration exist to achieve the most favorable coalescence and wetting behaviors of LMPA fillers for the metallization.
목차
Abstract
1. 서론
2. 실험 재료 및 실험 방법
3. 결과 및 고찰
4. 결론
References
참고문헌 (7)
참고문헌 신청
Myung Jin Yim / 2008 / Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging / Journal of Adhesion Science and Technology 22(14):1593~1630
H.K. Kim / 2001 / Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density / Microelectronics Journal 32(4):315~321
Hui-Wang Cui / 2013 / Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging / International Journal of Adhesion and Adhesives 44:232~236
임병승 / 2009 / 저융점 합금 필러를 이용한 도전성 접착제 및 이를 이용한 접합 프로세스 / 대한용접접합학회지 27(3):23~31
Byung-Seung Yim / 2012 / Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers / MATERIALS TRANSACTIONS 53(12):2104~2110
H.K. Kim / 2001 / Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density / Microelectronics Journal 32(4):315~321
Hui-Wang Cui / 2013 / Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging / International Journal of Adhesion and Adhesives 44:232~236
임병승 / 2009 / 저융점 합금 필러를 이용한 도전성 접착제 및 이를 이용한 접합 프로세스 / 대한용접접합학회지 27(3):23~31
Byung-Seung Yim / 2012 / Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers / MATERIALS TRANSACTIONS 53(12):2104~2110
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UCI(KEPA) : I410-ECN-0101-2019-581-000466149