메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
이형근 (한밭대학교)
저널정보
대한용접·접합학회 대한용접·접합학회지 大韓熔接·接合學會誌 第37卷 第3號
발행연도
2019.6
수록면
262 - 267 (6page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

이 논문의 연구 히스토리 (6)

초록· 키워드

오류제보하기
In this study, it was tried to analyze the effects of heat treatment temperature on the microstructure and wear characteristics of the hyper-eutectic Al-Si clad layer. The clad layer was produced by scanning pulsed Nd:YAG laser beam over the Si powder layer printed on the Al050 Al alloy base metal. The chemical composition of the clad layer was analyzed to be Al-20.8%Si. Despite the hyper-eutectic Al-Si composition, the clad layer mainly consisted of the very fine Al-Si eutectic microstructure without primary Si particles. The clad layers were heat-treated at 300 ℃, 400 ℃ and 500 ℃ for 5 hours. The specimen heat-treated at 300 ℃ retained the very fine Al-Si eutectic microstructure, but the continuity of Si particles in the Si network was broken. In the specimen heat-treated at 400 ℃, the Al-Si eutectic microstructure disappeared and fine Si particles were dispersed over the entire area. In the specimen heat-treated at 500 ℃, the melt-solidification traces disappeared and Si particles were grown considerably. The wear weight loss was the lowest in the as-cladded specimen and increased with the increase of heat-treatment temperature. Adhesive wear did not occur in the specimens as-cladded and heat-treated at 300 ℃, but occurred in the specimens heattreated at 400 ℃ and 500 ℃. The very fine Si networks in the Al-Si eutectic microstructure seemed to prevent adhesion of Al substrate to SKD 11 roll surface. Therefore, it was considered that there was no adhesive wear in the specimens which were as-cladded and heat-treated at 300 ℃.

목차

Abstract
1. 서론
2. 실험 방법
3. 실험 결과 및 검토
4. 결론
Reference

참고문헌 (6)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2019-581-000861660