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논문 기본 정보

자료유형
학술저널
저자정보
윤필근 (한밭대학교) 박덕용 (한밭대학교)
저널정보
한국표면공학회 한국표면공학회지 한국표면공학회지 제52권 제2호
발행연도
2019.4
수록면
78 - 83 (6page)

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초록· 키워드

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Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion (Ni<SUP>2+</SUP>) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing Ni<SUP>2+</SUP> concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing Ni<SUP>2+</SUP> concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M Ni<SUP>2+</SUP> concentration. Smooth surface morphologies were observed over 0.3 M Ni<SUP>2+</SUP> concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing Ni<SUP>2+</SUP> concentration. The average grain size was slightly increased at 0.3 M Ni<SUP>2+</SUP> concentration and then slightly decreased with increasing Ni<SUP>2+</SUP> concentration.

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Abstract
1. 서론
2. 실험방법
3. 결과 및 토의
4. 결론
References

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UCI(KEPA) : I410-ECN-0101-2019-581-000939358