Heat Dissipation Technology of IGBT Module Package

서일웅; 정훈선; 이영호; Young-Hun Kim; 좌성훈

Heat Dissipation Technology of IGBT Module Package

Recommendations

Search

IGBT 전력반도체 모듈 패키지의 방열 기술

Type: Academic journal

Author: 서일웅 정훈선 이영호 Young-Hun Kim 좌성훈

Journal: The Microelectronics And Packaging Society 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제21권 제3호 KCI Accredited Journals

Published: 2014.1

Pages: 7 - 17 (11page)

Usage

Heat Dissipation Technology of IGBT Module Package

Research history (4)

2015

Numerical Thermal Analysis of IGBT Module Package for Electronic Locomotive Power-Control Unit

Il Woong Suh , Young-ho Lee , Young-hoon Kim and others 1 Transactions of the Korean Society of Mechanical Engineers - A 2015.10 Academic journal

Thermal and fatigue analysis of power device for electronic locomotive power control unit

서일웅 2015.01 Thesis

2014

Thermal analysis of IGBT module for metro EMU

I. L. Suh , H. S. Jung , J. H. LEE and others 1 한국생산제조학회 학술발표대회 논문집 2014.09 Proceeding

Heat Dissipation Technology of IGBT Module Package

서일웅 , 정훈선 , 이영호 and others 2 마이크로전자 및 패키징학회지 2014.01 Academic journal

Are you curious about the follow-up research of this article?
You can check more advanced research results through related academic papers or academic presentations.
Check the research history of this article

Abstract· Keywords

Report Errors

Power electronics modules are semiconductor components that are widely used in airplanes, trains,automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) havebeen widely utilized in high power and fast switching applications for power management including power supplies,uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductorsfor high current applications in electrical and hybrid vehicles application. In these application environments, the physicalconditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermaland thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit thenumber of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in theIGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal designwhere the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBTmodules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management,as well as recent technology of the new package materials.

#Insulated gate bipolar transistor #package module #heat dissipation #thermal management.

No content found

References (26)

Add References

P. Cova / 2013 / Thermal optimization of water heat sink for power converters with tight thermal constraints / Microelectronics Reliability 53:1760

E. Neubauer / 2005 / Heat sink materials with tailored properties for thermal management / Proc. 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress :272

E. Neubauer / 2007 / Advanced Composite Materials with Tailored Thermal Properties for Heat Sink Applications / European Conference on Power Electronics and Applications :1

A. Morozumi / 2001 / Reliability design technology for power semiconductor modules / Fuji Electronic Review 47 (2) : 54 ~

B. A. Cola / 2007 / Photoacoustic characterization of carbon nanotube array thermal interfaces / J. Appl. Phys. 101 : 054313 ~