지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한국진공학회(ASCT) Applied Science and Convergence Technology Applied Science and Convergence Technology Vol.23 No.6
- 발행연도
- 2014.11
- 수록면
- 345 - 350 (6page)
이용수
초록· 키워드
오류제보하기
The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the solder surface of Sn-Ag-Cu-In solder alloy is surrounded by a thin InOx layer after reflow process; this coating protects the metallic surface from thermal oxidation. Based on this result, we have performed a wetting balance test at various temperatures. The Sn-Ag-Cu-In solder alloy shows characteristics of both thermal oxidation and wetting balance better than those of Sn-Ag-Cu solder alloy. Therefore, Sn-Ag-Cu-In solder alloy is a good candidate to solve the two problems of easy oxidation and low wettability, which are the most critical problems of Pb-free solders.
목차
I. Introduction
II. Experimental
III. Results and Discussion
IV. Conclusions
References
참고문헌 (18)
참고문헌 신청
1. [학술지(정기간행물)] - J. Görlich / 2005 / / Appl. Phys. Lett. 86 : 053106 ~
2. [학술지(정기간행물)] - K. N. Tu / 2003 / / J. Appl. Phys. 93 : 1335 ~
3. [학술지(정기간행물)] - M. C. Liew / 2012 / / Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 43 : 3742 ~ 3747
4. [학술지(정기간행물)] - S. V. Sattiraju / 2002 / / IEEE T. Electron. Pack. 25 : 168 ~ 184
5. [학술지(정기간행물)] - K. -O. Lee / 2010 / / Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 41 : 1805 ~ 1814
2. [학술지(정기간행물)] - K. N. Tu / 2003 / / J. Appl. Phys. 93 : 1335 ~
3. [학술지(정기간행물)] - M. C. Liew / 2012 / / Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 43 : 3742 ~ 3747
4. [학술지(정기간행물)] - S. V. Sattiraju / 2002 / / IEEE T. Electron. Pack. 25 : 168 ~ 184
5. [학술지(정기간행물)] - K. -O. Lee / 2010 / / Metall. Mater. Trans. A-Phys. Metall. Mater. Sci. 41 : 1805 ~ 1814
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UCI(KEPA) : I410-ECN-0101-2019-420-001275284