지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
오류제보하기
With an increased production of Printed Circuit Boards (PCBs) in electronic equipment, the consumption of solder alloys is growing globally. Recently, increasing importance of recycling solder scrap has been recognized. Generally, solder scrap contains many impurities such as plastics and other metals. Hazardous components must be eliminated for recycling solder scrap. The present work studied pretreatment for reuse of solder scrap alloys. An experiment was conducted to enhance the cleanliness of solder scrap melt and eliminate impurities, especially lead. Physical separation with sieving and magnetic force was made along with pyrometallurgical methods. A small decrease in lead concentration was found by high temperature treatment of solder scrap melt. The impurities were removed by filtration of the solder scrap melt, which resulted in improvement of the melt cleanliness. A very low concentration of lead was achieved by a zone melting treatment with repeated passage. This study reports on a pretreatment process for the reuse of solder scrap that is lead free.
목차
등록된 정보가 없습니다.
참고문헌 (8)
참고문헌 신청
2000 / Metallic Materials Engineering Dictionary / Korean Institute of Metals and Materials, Jibmoonsa :723
J. C. Lee / 2009 / Development of Technology for the Recycling of Urban Ore :124
http://solder.tistory.com/107
O. Kubaschewski / 1979 / Metallurgical Thermochemistry / Pergamon Press :368~372
R. Hultgren / 1973 / Selected Values of the Thermodynamic Properties of Binary Alloys / American Society for Metals :1266~1268
J. C. Lee / 2009 / Development of Technology for the Recycling of Urban Ore :124
http://solder.tistory.com/107
O. Kubaschewski / 1979 / Metallurgical Thermochemistry / Pergamon Press :368~372
R. Hultgren / 1973 / Selected Values of the Thermodynamic Properties of Binary Alloys / American Society for Metals :1266~1268
이 논문의 저자 정보
최근 본 자료
댓글(0)
0