핫멜트 결합공정을 통한 페놀 필름의 제조 및 경화거동 분석

강송희; 조하니; 김경식; 김국진; 이승구

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자료유형: 학술저널

저자정보: 강송희 (충남대학교 유기소재.섬유시스템공학과) 조하니 (충남대학교 유기소재.섬유시스템공학과) 김경식 ([주]넥스컴스) 김국진 ([주]디씨티) 이승구 (충남대학교 유기소재.섬유시스템공학과)

저널정보: 한국섬유공학회 한국섬유공학회지 한국섬유공학회지 제55권 제5호

발행연도: 2018.1

수록면: 365 - 371 (7page)

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In this study, highly releasable phenol films were prepared for simplification of the phenolic composite molding process. Thermoplastic polyvinyl butyral (PVB) was added to the phenolic resin to give the phenol film a high releasability by the hot-melt bonding process. The thermal properties of the prepared phenolic film were analyzed with DSC and TGA, and both degree of cure and active energy were calculated using the DSC data. The rheological properties of the film were analyzed using a rheometer, and the tackiness of the film was assessed by the probe tack test according to the heat treatment time. Curing reaction of the phenolic film occurred at a temperature $20^{\circ}C$ higher than that of the phenolic resin, and its activation energy was also considerably higher. This can be attributed to the gelation caused by the hydrogen bonding between the PVB and phenolic monomer. Thus, the curing of the film is delayed by gelation.

#hot-melt method #phenolic film #curing behavior #polyvinyl butyral

참고문헌 (14)

참고문헌 신청

S. Ma / 2007 / Development of Epoxy Matrix Composites for Rapid Tooling Applications / J. Mater. Proc. Technol. 192:75~82

F. Y. Hshieh / 1997 / Flammability Testing of Flame‐retarded Epoxy Composites and Phenolic Composites / Fire and Materials 21:41~49

H. L. N. Mcmanus / 1992 / High Temperature Thermomechanical Behavior of Carbon-phenolic and Carboncarbon Composites, I. Analysis / J. Compos. Mater. 26:206~229

K. J. Ahn / 1993 / Prepreg Processing Science and Engineering / Polym. Eng. Sci 33:1177~1188

C. S. Tyberg / 1999 / Tough, Void-free, Flame Retardant Phenolic Matrix Materials / Constr. Buil. Mater. 13:343~353

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