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A Study on an Apparatus for the Metal Material Thickness Measurement in High Temperature by Magnetostrictive Ultrasonic Method
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Type
Proceeding
Author
Ji Yeon Shin (Kyung Hee University) Ting Ting Zhang (Kyung Hee University) Tong In Oh (Kyung Hee University) Soo Woon Park (UMI(Universal Monitoring & Inspection)) Yong Cheol Kim (UMI(Universal Monitoring & Inspection)) Seung Bong Lee (UMI(Universal Monitoring & Inspection)) Kwang Sik Yoon (UMI(Universal Monitoring & Inspection))
Journal
The Institute of Electronics and Information Engineers 대한전자공학회 학술대회 2020 IEIE SUMMER CONFERENCE
Published
2020.8
Pages
1,076 - 1,079 (4page)

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A Study on an Apparatus for the Metal Material Thickness Measurement in High Temperature by Magnetostrictive Ultrasonic Method
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In vary high temperature conditions a metal material thickness measurement is of importance in the phenomena associated with the nuclear accident, in connection with the demonstration experiments of In-vessel phenomenon. In this case a hemispherical thickness measuring apparatus and method using a magnatostrictive ultrasonic wave that can be suggested to measure for this thickness change in real time as the ultrasonic wave apparatus is secured.

Contents

Abstract
I. Introduction
II. Apparatus for the Metal Material Thickness Measurement
III. System Setup and Measurement Results
IV. Conclusion and Future Research Directions
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