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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2021.8
- 수록면
- 402 - 408 (7page)
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초록· 키워드
오류제보하기
Epoxy adhesives, particularly for non-conductive pastes, are used in 3D chip-stack flip-chip packages to reinforce the mechanical strength of joints. Although the thickness of the adhesive layer is relatively small, its thermal conductivity is known to have a major effect on the heat dissipation behavior of chipstack packages. Because conventional thermal conductivity measurement methods such as the laser flash method are based on the bulk specimens having thicknesses greater than several mm, they are limited in their ability to measure the thermal conductivity of thin adhesive layers between silicon dies. In this study, a modified guarded hot-plate method is proposed using standard joint layer samples of known thermal conductivity, and the measurement results are compared with those of the laser flash method. Results showed that, based on a constant heat flux from heat source to heat sink, the temperature difference at both sides of the joint layers was proportional to the thermal resistivity of the joint layer materials. The thermal conductivity of the under-test joint layer could therefore be determined from the thermal conductivity spectrum of the known samples using a graphical method. Although the measured values by the modified guarded hot-plate method were slightly higher than those derived from the laser flash method due to the thickness effect, it was concluded that the modified guarded hot-plate method could be a practical method in measuring the thermal conductivity of thin adhesive joint layers.
목차
Abstract
1. 서론
2. 실험 방법
3. 결과 및 고찰
4. 결론
References
참고문헌 (7)
참고문헌 신청
J. W. Yoon / 2007 / Flip-chip Bonding Technology and Reliability of Electronic Packaging / J. Korean Weld. Join. Soc 25(2):108~117
S.F. Al-Sarawi / 1998 / A review of 3-D packaging technology / IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 21(1):2~14
B. Dang / 2006 / Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink / IEEE Electron Device Letters 27(2):117~119
박만석 / 2013 / 3D IC 열관리를 위한 TSV Liquid Cooling System / 마이크로전자 및 패키징학회지 20(3):1~6
M. Alahmad / 2003 / Heat Transfer Challenges in Semiconductors Processing and the Applications of Heat Pipes for Efficient Heat Removal / Journal of King Saud University - Engineering Sciences 15(1):141~154
S.F. Al-Sarawi / 1998 / A review of 3-D packaging technology / IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B 21(1):2~14
B. Dang / 2006 / Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink / IEEE Electron Device Letters 27(2):117~119
박만석 / 2013 / 3D IC 열관리를 위한 TSV Liquid Cooling System / 마이크로전자 및 패키징학회지 20(3):1~6
M. Alahmad / 2003 / Heat Transfer Challenges in Semiconductors Processing and the Applications of Heat Pipes for Efficient Heat Removal / Journal of King Saud University - Engineering Sciences 15(1):141~154
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