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이민준; 배진원; 박수연; 최재익; 김건호; 서종현

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자료유형: 학술저널

저자정보: 이민준 (한국항공대학교) 배진원 (한국항공대학교) 박수연 (한국항공대학교) 최재익 (한국항공대학교) 김건호 (큐프럼 머티리얼즈) 서종현 (한국항공대학교)

저널정보: 한국표면공학회 한국표면공학회지 한국표면공학회지 제56권 제2호

발행연도: 2023.4

수록면: 160 - 168 (9page)

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Recently, investigation on metallization is a key for a stretchable display. Amorphous metal such as Ni and Zr based amorphous metal compounds are introduced for a suitable material with superelastic property under certain stress condition.
However, Ni and Zr based amorphous metals have too high resistivity for a display device’s interconnectors. In addition, these metals are not suitable for display process chemicals. Therefore, we choose an aluminum based amprhous metal Al-Mo as a interconnector of stretchable display.
In this paper, Amorphous Forming Composition Range (AFCR) for Al-Mo alloys are calculated by Midema"s model, which is between 0.1 and 0.25 molybdenum, as confirmed by X-ray diffraction (XRD).
The elongation tests revealed that amorphous Al-20Mo alloy thin films exhibit superior stretchability compared to pure Al thin films, with significantly less increase in resistivity at a 10% strain. This excellent resistance to hillock formation in the Al20Mo alloy is attributed to the recessed diffusion of aluminum atoms in the amorphous phase, rather than in the crystalline phase, as well as stress distribution and relaxation in the aluminum alloy.
Furthermore, according to the AES depth profile analysis, the amorphous Al-Mo alloys are completely compatible with existing etching processes. The alloys exhibit fast etch rates, with a reasonable oxide layer thickness of 10 nm, and there is no diffusion of oxides in the matrix. This compatibility with existing etching processes is an important advantage for the industrial production of stretchable displays.

#Aluminum-molybdenum alloy #Miedemas model #Stretchable display: Hillock #metal interconnector

참고문헌 (10)

참고문헌 신청

J. Xu, S. Wang, G.J. N. Wang, C. Zhu, S. Luo, L. Jin, X. Gu, S. Chen, V. R. Feig, J. W. F. To, S. R. Gagné, J. Park, B. C. Schroeder, C. Lu, J. Y. Oh, Y. Wang, Y.H. Kim, H. Yan, R. Sinclair, D. Zhou, G. Xue, B. Murmann, C. Linder, W. Cai, J. B. H. Tok, J.

J. Byun, B. Lee, E. Oh, H. Kim, S. Kim, S. Lee, Y. Hong, Fully printable, strain-engineered electronic wrap for customizable soft electronics, Sci. Rep., 7 (2017) 45328.

J. Byun, E. Oh, B. Lee, S. Kim, S. Lee, Y. Hong, A single droplet-printed doubleside universal soft electronic platform for highly integrated stretchable hybrid electronics, Adv. Funct. Mater., 27 (2017) 1701912.

Y. Kang, Hillock behavior on aluminum thin films deposited on polyimide film, Korean J. Mater. Res., 8 (1998) 802-806.

M. Liu, C. R. Cao, Y. M. Lu, W. H. Wang, H. Y. Bai, Flexible amorphous metal films with high stability, Appl. Phys. Lett., 110 (2017) 031901.

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