메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
신윤정 (한양대학교) 오민정 (연세대학교) 최성용 (한양대학교)
저널정보
한국경영과학회 경영과학 經營科學 第40卷 第1號
발행연도
2023.3
수록면
19 - 32 (14page)
DOI
10.7737/KMSR.2023.40.1.019

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
This study aims to analyze the main causes of ripple effect and their degree of risk propagation under supply chain disruption. To achieve the purpose of this study, we derived the priority of main causes for managing ripple effect focusing on domestic manufacturing companies and logistics & distribution companies using AHP method. The main results of this study are as follows. As a result of multiplying the weights of the 1st and 2nd layers, it was confirmed that the structural vulnerability factor of the supply chain had the highest weight value. In addition, the results of group comparison by the type of industry, business size, and manufacturing category are as follows. First, the uncertainty of suppliers and buyers was found to be important for logistics and distribution companies to manage the ripple effect. Second, while large enterprises evaluated the sub-factors of supply chain structural vulnerability as the most important, SMEs(Small and Medium-sized Enterprises) were identified to require more careful management of complexity and dependence on suppliers and buyers. Third, unlike consumer goods manufacturing, the three major factors of assembly and processing manufacturing are all related to supply chain structural vulnerability. This study provides academic implications by identifying the factors of the ripple effect and quantifying the degree of risk propagation. In addition, it is proposed to effectively manage the main causes of ripple effects according to industry type, business size, and characteristics of each company.

목차

Abstract
1. 서론
2. 이론적 배경
3. 연구의 방법
4. 연구 결과
5. 토론
6. 결론
참고문헌

참고문헌 (0)

참고문헌 신청

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2023-325-001544869