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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2024.4
- 수록면
- 404 - 410 (7page)
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초록· 키워드
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This study focuses on thermal analysis to optimize the heat dissipation system in high-performance laptops. As laptops become lighter and slimmer while their performance increases, the heat generated by the main board becomes significant. Efficiently removing this thermal energy to lower the laptop"s temperature is crucial in heat dissipation design. The high temperature from the CPU on the laptop"s motherboard is transferred to the heat sink via a heat pipe, with heat being expelled through forced convection by a cooling fan. Optimizing the heat sink"s design can significantly enhance the laptop"s performance and minimize heat generation. We applied a systemintegrated numerical analysis capable of predicting a laptop"s heating level and introduced a meta-structured heat sink fabricated using metal 3D printing to enhance heat dissipation, aiming to significantly reduce the laptop"s surface temperature. The findings of this study are expected to serve as a vital methodology for the development of high-performance laptops in the future.
목차
Abstract
1. 서론
2. 관련 이론
3. 해석 모델 및 결과
4. 결론
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