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논문 기본 정보

자료유형
학술대회자료
저자정보
Chih-Ming Tzeng (Industrial Technology Research Institute) Pin-Tzu Chiu (National Taiwan University of Science and Technology) M.H. Pong (National Taiwan University of Science and Technology) Yan-Cheng Liu (Industrial Technology Research Institute) Chun-Jen Yao (National Taiwan University of Science and Technology) Hsin-Han Lin (Industrial Technology Research Institute) Yu-Hua Cheng (Industrial Technology Research Institute) Huang-Jen Chiu (National Taiwan University of Science and Technology)
저널정보
전력전자학회 ICPE(ISPE)논문집 ICPE 2023-ECCE Asia
발행연도
2023.5
수록면
255 - 259 (5page)

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Common mode current constituents a large part of EMI generated in power converters especially those power modules with a baseplate. It is most useful to be able to illustrate the noise current paths especially the CM current which flows through stray capacitance. This work illustrates a method to work out the critical current paths. FEA software computes the capacitances from the module layout structure. Power device capacitances are also included. Circuit simulation computes currents in various branches and verified by experiment. This work reveals that in addition to the knowledge that the switching node produces significant common mode current, the power rails are also essential coupling paths above the module baseplate. This is because of the linkage to the switching node by high device capacitances.

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Abstract
Ⅰ. INTRODUCTION
Ⅱ. MODELING A SIC MODULE
Ⅲ. CIRCUIT SIMULATION OF COMMON MODE NOISE
Ⅳ. EXPERIMENTAL WORK AND COMPARISON WITH SIMULATION
Ⅴ. INTERPRETATION AND IDENTIFICATION OF ESSENTIAL CM COUPLING PATHS
Ⅵ. CONCLUSION
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