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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2023.5
- 수록면
- 2,032 - 2,038 (7page)
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Higher levels of integration for improved functionality along with increased power density are important for electronics in future vehicle platforms, where greater efficiency and reduced volume are critical. Power switching devices (e.g., IGBT, MOSFET), driver boards, and cooling devices are three important components of a power electronic system. The design and integration of these three components strongly impact the efficiency, power density, and reliability of the power electronics. In the current work, a few highly integrated power electronic solutions with extremely high-power density were proposed. Detailed comparisons of the concepts in terms of cooling performance, thermal stress at the assembling interface, cost, reliability, feasibility, etc. were conducted and summarized. It was found that the concept of ceramic-polymer blend based bonding between the PCB and cold plate provided excellent cooling performance and the lowest thermal stress at the bonding interface, which makes it one of the most promising solutions.
목차
Abstract
Ⅰ. INTRODUCTION
Ⅱ. CONCEPTS AND METHODS
Ⅲ. MODELING AND EQUATIONS
Ⅳ. RESULTS AND DISCUSSIONS
Ⅴ. CONCLUSION
REFERENCES
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