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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2023.5
- 수록면
- 2,302 - 2,307 (6page)
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초록· 키워드
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Although multilevel converters are used in high-voltage and high-power applications because they need a large number of power devices with a higher cost compared with general two-level converters. However, fruitful characteristics in the multilevel converters such as lower harmonics and lower electromagnetic interference are essentially useful even in low-power applications. To utilize the multilevel converters in low-power applications, an innovative implementation technology is needed to reduce the cost of many power devices and peripheral circuits. In this paper, a monolithic five-level flying capacitor multi-level converter is presented as a game-changing implementation. The 1-chip converter configured by multiple power devices is expected to achieve higher power density and lower cost. A prototype monolithic chip consists of eight lateral-type Si- MOSFETs, and it enables to increase the number of output levels by multiple chip connections utilizing a ladder circuit configuration. It is verified that the prototype IC of the five-level flying capacitor converter can work well. Finally, from the result, it is pointed out that there are some bottlenecks in the thermal design, loss reduction, and layout design to realize the 1-chip integrated implementation.
목차
Abstract
I. INTRODUCTION
II. DESIGN AND IMPLEMENTATION OF A ONE-CHIP FLYING CAPACITOR MULTILEVEL CONVERTER
III. EXPERIMENT
IV. DISCUSSION FOR AN IMPLEMENTATION OF MULTILEVEL CONVERTERS INTO A MONOLITHIC IC
V. CONCLUSIONS
REFERENCES
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