Time Domain Sensitivity of High-Speed VLSI Interconnects

Nelson Liu ,  Michel S. Nakhia ,  Qi Jun Zhang

ICVC : International Conference on VLSI and CAD

1993 .01

Thermal Characteristics of a Multichip Module Using PF-5060 and Water

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

1999 .05

Multichip 아키텍춰 합성 알고리듬 설계 ( The design of a Synthesis Algorithm for Multichip Architectures )

박재환 ,  전홍신 ,  황선영

전자공학회논문지-A

1994 .12

Novel Characterisation Methods for Polymer Applications

Rob Bailey ,  Alan McNicol ,  Paul Lambe 외 1명

한국고분자학회 학술대회 연구논문 초록집

2006 .10

Heat Transfer Characteristics of the Multichip Module with High Heat Flux

M. G. Choi ,  Keum Nam Cho

Heat Transfer Conference

1998 .08

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masa ,  u Ishizuka ,  Hideo Iwasaki 외 1명

Heat Transfer Conference

1998 .08

APPLICATION OF THE THERMAL NETWORK METHOD TO THE TRANSIENT THERMAL ANALYSIS OF MULTICHIP MODULES

Masa ,  u Ishizuka

KSME/JSME THERMAL and FLUID Engineering Conference

1996 .10

Influence of an Aspect Ratio of Rectangular Channel on the Cooling Performance of a Multichip Module

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

2000 .03

멀티칩 모듈 기술 ( Multichip Module ( MCM ) Technology )

백경욱

대한기계학회지

1996 .10

An Integrated Environment for Electrical Modeling and Characterization of Packages and Interconnects in High-Speed VLSI System

Soo-Young Oh

JOURNAL OF KIEE

1990 .03

THE THERMAL PERFORMANCE OF OPEN-TYPE TWO-PHASE LOOP THERMOSYPHONS FOR MULTICHIP MODULE

Won Tae Kim ,  Yoon Pyo Lee ,  Seong Young Yoon

KSME/JSME THERMAL and FLUID Engineering Conference

1996 .10

SIMS: Circuit Interconnect Modeling Environment for VLSI Design

차건업 ,  정원영 ,  김용배 외 2명

대한전자공학회 학술대회

1994 .07

Transient Characteristics of a Two-Phase Thermosyphon Loop for Multichip Module

Sang-Sig Nam ,  Sung-Bong Choi ,  Jae-Hee Kim 외 1명

[ETRI] ETRI Journal

1998 .06

Characterisation of floor impact sources

Raine ,  Thaden ,  Thomas B 외 1명

한국소음진동공학회 국제학술발표논문집

2003 .08

고속 VLSI 회로에서 전송선의 지연시간 모델

윤성태 ,  어영선

대한전자공학회 학술대회

1999 .11

Estimation of Dynamic Power Dissipation on VLSI Interconnect

Bang-Hyun Sung ,  Joong-Ho Pa ,  k 외 1명

ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications

2005 .07

VLSI 회로 연결선의 동적 전력 소모 계산법

박중호 ,  정문성 ,  김승용 외 1명

전자공학회논문지-SD

2004 .02

SIMS ( SPICE Interconnect Modeling System ) for VLSI design

정원영 ,  차건업 ,  김용배 외 2명

대한전자공학회 학술대회

1994 .01

Thermal Analysis and Optimization of 6.4 W Si-Based Multichip LED Packaged Module

Zo ,  igt Chuluunbaata ,  Nam Young Kim

한국통신학회논문지

2014 .03

Effect of Chip Spacing in a Multichip Module on the Heat Transfer for Paraffin Slurry Flow

Min Goo Choi ,  Keum Nam Cho

KSME International Journal

2000 .09