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In this work, we have reported improvement of film structure, adhesion, electrical resistivity and Na diffusion from the substrate into the Cu(InGa)Se₂(CIGS) films through Mo back contact. As the Ar working pressure is decreased, the resitivity of Mo films decrease while the films exhibited poor adhesion under 3mTorr. And a dense Mo film is obtained when its are deposited at low Ar working pressure. But the deposited at high Ar working pressure shows an increase in (110) peak width and it means small grain size and poor crystallinity. We have achieved a good film adhesion bi-layer process that involves the deposition of a thin layer(~100㎚) at high working pressure followed by a thicker layer(~900㎚) deposited at low Ar working pressure. The resistivity of Mo film is about 5×10^(-5)Ωㆍ㎝.
SIMS depth profiles were used to characterize the concenstrations of Na, O and Se after deposition Cu(InGa)Se₂ film on the Mo films. The Mo film deposited at high Ar pressure shows highly concentration of Se and O elements due to less dense microstructur. It means the formation of Mo-selenide and Mo-oxide in the Cu(InGa)Se₂/Mo interface and those formation prevent ohmic contact. In Mo back contact, Na impurity levels show that the Mo film deposited at low Ar pressure contains significantly less Na than that deposited at high Ar pressure. And the relatively high Na concentrations at the Cu(InGa)Se₂ surface have been detected.

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UCI(KEPA) : I410-ECN-0101-2009-563-018151912