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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 저널정보
- 한국생산제조학회 한국생산제조학회 학술발표대회 논문집 Proceedings of the International Conference of Manufacturing Technology Engineers (ICMTE) 2012
- 발행연도
- 2012.10
- 수록면
- 47 - 50 (4page)
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초록· 키워드
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This paper proposes a new method for silicon wafer edge treatment by Ultrasonic Assisted Fixed-Abrasive CMP (UA-CMP). In this method, a disc-shaped pellet containing CeO2 abrasives is attached on the end face of an ultrasonic head which is elliptically vibrated at an ultrasonic frequency and rotated at a given speed, and is pressed on the work-surface of silicon wafer edge at a certain normal force. Thus solid-state chemical reaction occurs between CeO2 abrasives and silicon to form an amorphous Ce-O-Si which is easily removed from the silicon by the mechanical action due to the ultrasonic vibration and rotation of the pellet. An experimental apparatus is produced followed by experimental confirmation of fundamental performance. Subsequently, the effects of several processing parameters on the edge surface roughness are investigated experimentally to reveal the fundamental processing characteristics.
목차
1. Introduction
2. Processing principle
3. Experimental methodology
4. Experimental results and discussion
5. Conclusions
REFERENCES
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