지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
오류제보하기
The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.
목차
Abstract
1. 서론
2. 열화 시험 및 데이터 수집
3. 열화 시험 데이터 분석 및 수명 추정
4. 결론 및 향후 연구
참고문헌
참고문헌 (7)
참고문헌 신청
1. [학술지(정기간행물)] - E. H. Wong / 2002 / Comprehensive treatment of moisture induced failure-recent advances / IEEE Transactions on Electronics Packaging Manufacturing 25 (3) : 223 ~ 230
2. [학술지(정기간행물)] - Hsu, C.-M / 2012 / An investigation on the shear toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb solder ball joints / Advanced Materials Research 476-478 : 2455 ~ 2458
3. [학술지(정기간행물)] - Kar, Y.B / 2012 / Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests / Microelectronics Reliability 53 (1) : 164 ~ 173
4. [학술대회논문] - Luan J / 2003 / Modal analysis and dynamic responses of board level drop test / Proceedings of the 5th electronics packaging technology conference : 233 ~ 243
5. [학술지(정기간행물)] - M.A. Alam / 2007 / A comprehensive model for PMOS NBTI degradation: Recent progress 47 (6) : 853 ~ 862
2. [학술지(정기간행물)] - Hsu, C.-M / 2012 / An investigation on the shear toughness for Sn/3.0Ag/0.5Cu and Sn/37Pb solder ball joints / Advanced Materials Research 476-478 : 2455 ~ 2458
3. [학술지(정기간행물)] - Kar, Y.B / 2012 / Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests / Microelectronics Reliability 53 (1) : 164 ~ 173
4. [학술대회논문] - Luan J / 2003 / Modal analysis and dynamic responses of board level drop test / Proceedings of the 5th electronics packaging technology conference : 233 ~ 243
5. [학술지(정기간행물)] - M.A. Alam / 2007 / A comprehensive model for PMOS NBTI degradation: Recent progress 47 (6) : 853 ~ 862
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UCI(KEPA) : I410-ECN-0101-2014-320-003225196