지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering 한국정밀공학회지 Vol.31 No.10
- 발행연도
- 2014.10
- 수록면
- 873 - 879 (7page)
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초록· 키워드
오류제보하기
UV curable adhesives with different acrylic functionalities were synthesized for temporary bonding and debonding process in 3D multi-chip packaging process. The aim is to study various factors which have an influence on UV curing. The properties and curing behaviors were investigated by gel fraction, peel strength, probe tack, and shear adhesion failure temperature. The results show that the properties and curing behaviors are dependent on not only acrylic functionalities of binders but also UV doses and coating thickness.
목차
1. 서론
2. 본론
3. 결론
REFERENCES
참고문헌 (19)
참고문헌 신청
Lee, S. -W. / 2013 / Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging / Polym. Sci. Technol. 24(3):277~284
이승우 / 2010 / Adhesion Performance of UV-curable Debonding Acrylic PSAs with Different Thickness in Thin Si-wafer Manufacture Process / 접착 및 계면 11(3):120~125
Bilenberg, B. / 2004 / PMMA to SU-8 Bonding for Polymer Based Lab-on-a-chip Systems with Integrated Optics / J. Micromech. Microeng 14(6):814~817
Puligadda, R. / 2007 / High-Performance Temporary Adhesives for Wafer Bonding Applications / MRS Proceedings 970:239~252
Moore, J. / 2004 / High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing / CS MANTECH 8:810~812
이승우 / 2010 / Adhesion Performance of UV-curable Debonding Acrylic PSAs with Different Thickness in Thin Si-wafer Manufacture Process / 접착 및 계면 11(3):120~125
Bilenberg, B. / 2004 / PMMA to SU-8 Bonding for Polymer Based Lab-on-a-chip Systems with Integrated Optics / J. Micromech. Microeng 14(6):814~817
Puligadda, R. / 2007 / High-Performance Temporary Adhesives for Wafer Bonding Applications / MRS Proceedings 970:239~252
Moore, J. / 2004 / High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing / CS MANTECH 8:810~812
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UCI(KEPA) : I410-ECN-0101-2015-550-002759817