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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2014.10
- 수록면
- 1 - 8 (8page)
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Heat dissipation of the high power LED is a critical issue. To estimate the junction temperature of the LED chip is most important in characterizing the heat dissipation, but it is impossible to directly measure it. In this study, surface temperatures of the 12.8W LED bulb was measured for 5 points using a data logger and compared with the simulated results using a thermal simulator based on FVM (finite volume method) to secure a reliability of the simulation. Effects of some factors such as lens, emissivity and air inlet were investigated using simulation works and then the results were analysed.
목차
Abstract
1. 서론
2. 실험방법
3. 실험결과 및 토의
4. 결론
References
참고문헌 (13)
참고문헌 신청
1. [학술지(정기간행물)] - Bladimir Ramos-Alvarado. / 2013 / Comparison and optimization of single-phase liquid cooling devices for the heat dissipation of high-power LED arrays / Applied Thermal Engineering 59 (1-2) : 648 ~ 659
2. [학술지(정기간행물)] - Ting Cheng. / 2010 / Thermal analysis and optimization of multiple LED packaging based on a general analytical solution / International Journal of Thermal Sciences 49 (1) : 196 ~ 201
3. [학술지(정기간행물)] - Lu Ma. / 2013 / Cooling of high power LEDs through ventilating ambient air to front surface of chip / Heat Mass Transfer 49 (1) : 85 ~ 94
4. [학술지(정기간행물)] - Lianqiao Yang. / 2008 / Thermal Analysis of GaN-Based Light Emitting Diodes With Different chip Sizes / IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 8 (3) : 571 ~ 575
5. [학술지(정기간행물)] - Bo-Hung Liou. / 2012 / Improvement of thermal management of high-power GaN-based light-emitting diodes / Microelectronics Reliability 52 (5) : 861 ~ 865
2. [학술지(정기간행물)] - Ting Cheng. / 2010 / Thermal analysis and optimization of multiple LED packaging based on a general analytical solution / International Journal of Thermal Sciences 49 (1) : 196 ~ 201
3. [학술지(정기간행물)] - Lu Ma. / 2013 / Cooling of high power LEDs through ventilating ambient air to front surface of chip / Heat Mass Transfer 49 (1) : 85 ~ 94
4. [학술지(정기간행물)] - Lianqiao Yang. / 2008 / Thermal Analysis of GaN-Based Light Emitting Diodes With Different chip Sizes / IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 8 (3) : 571 ~ 575
5. [학술지(정기간행물)] - Bo-Hung Liou. / 2012 / Improvement of thermal management of high-power GaN-based light-emitting diodes / Microelectronics Reliability 52 (5) : 861 ~ 865
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