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자료유형
학술저널
저자정보
저널정보
한국전기전자재료학회 전기전자재료학회논문지 전기전자재료학회논문지 제20권 제7호
발행연도
2007.1
수록면
600 - 605 (6page)

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Process variables for manufacturing the CuInSe2 thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the CuInSe2, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1 : 1, while the surface temperature having an effect on the quality of the thin film was changed from 100 ℃ to 300 ℃ at intervals of 50 ℃. The diffract fringe of X-ray, which depended upon the substrate temperature and the Annealing temperature of the manufactured CuInSe2 thin film, was investigated. scanning electron microgaphs of represents a case that a sample manufactured at the substrate temperature of 100 ℃ was thermally treated at 200~350 ℃. As a result, at 500 ℃ of the Annealing temperature, their chemical composition was measured in the proportion of 1 : 1 : 2. It could be known that under this condition, the most excellent thin film was formed, compared with the other conditions.

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