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This article brieḀy reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.
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참고문헌 (26)
참고문헌 신청
Aksoz S / 2011 / Determination of thermal conductivity and interfacial energy of solid Zn solition in the Zn-Al-Bi eutectic system / Exp. Therm. Fluid. Sci 35 : 395 ~ 404
Chen S W / 2006 / Lowering of Sn-Sb alloy melting points caused by substrate dissolution / J. Electron. Mater 35 : 1982 ~ 1985
Chen S W / 2008 / Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples / Mater. Chem. Phys 111 : 17 ~ 19
Cheng F / 2012 / Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys / Microelectron. Reliab 52 : 579 ~ 584
El-Daly A A / 2011 / Creep behavior of near-peritectic Sn-5Sb solders containing small amounts of Ag and Cu / Mater. Sci. Eng. A 528 : 1055 ~ 1062
Chen S W / 2006 / Lowering of Sn-Sb alloy melting points caused by substrate dissolution / J. Electron. Mater 35 : 1982 ~ 1985
Chen S W / 2008 / Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples / Mater. Chem. Phys 111 : 17 ~ 19
Cheng F / 2012 / Sn addition on the tensile properties of high temperature Zn-4Al-3Mg solder alloys / Microelectron. Reliab 52 : 579 ~ 584
El-Daly A A / 2011 / Creep behavior of near-peritectic Sn-5Sb solders containing small amounts of Ag and Cu / Mater. Sci. Eng. A 528 : 1055 ~ 1062
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