지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
오류제보하기
The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.
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참고문헌 (21)
참고문헌 신청
B. Balogh / 2008 / Failure analysis methods in electronics assembly technology / Mater. Sci. Forum 589:349~354
Bálint Balogh / 2008 / Analysis of solder joint failures arisen during the soldering process / Periodica Polytechnica Electrical Engineering 52(1-2):5
B. Balogh / 2006 / Applications and comparison of failure analysis methods / 29th International Spring Seminar on Electronic Technology :14~19
Todd Castello / 2006 / Failure analysis techniques for lead‐free solder joints / Soldering & Surface Mount Technology 18(4):21~27
R Champaign / 2007 / Shock Induced Fracture of SAC Solder Balls Under Tensile Load / Microscopy and Microanalysis 13(S02)
Bálint Balogh / 2008 / Analysis of solder joint failures arisen during the soldering process / Periodica Polytechnica Electrical Engineering 52(1-2):5
B. Balogh / 2006 / Applications and comparison of failure analysis methods / 29th International Spring Seminar on Electronic Technology :14~19
Todd Castello / 2006 / Failure analysis techniques for lead‐free solder joints / Soldering & Surface Mount Technology 18(4):21~27
R Champaign / 2007 / Shock Induced Fracture of SAC Solder Balls Under Tensile Load / Microscopy and Microanalysis 13(S02)
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