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논문 기본 정보

자료유형
학술저널
저자정보
김성훈 (한양대학교 섬유공학과) 박재기 (한국생산기술연구원 섬유기술개발센타)
저널정보
한국섬유공학회 한국섬유공학회지 한국섬유공학회지 제34권 제3호
발행연도
1997.1
수록면
178 - 184 (7page)

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Wet process with KOH aqueous solutions was performed for the surface treatment of polyimide films. Surface energy and mechanical property of surface treated commercial polyimide films in wet process were investigated. The value of surface energy in wet process was increased rapidly at the beginning of treatment time. However, the tensile strength of the surface modified polyimide films were decreased with increasing treatment time The lap shear strength measurement revealed that the value of lap shear strength was increased in the beginning of treatment time. However the value of lap shear strength was decreased as treatment time goes by. It seems that irregular adhesion on the surface modified polyimide films in the pressing due to the excessive etching on the surface of polyimide films. The phenomena were confirmed by SEM. The factors of improvement of polyimide adhesion were the applied pressure for the bonding process, drying time after surface modification and surface energy as the index of surface polarity (The lap shear strength decrement with increasing treatment time is induced by the irregular adhesion of the excessively etched polyimide surfaces)

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