Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints

Shengyan Shang; Anil Kunwar; Jinye Yao; Yanfeng Wang; Haitao Ma; Yunpeng Wang

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자료유형: 학술저널

저자정보: Shengyan Shang (Dalian University of Technology) Anil Kunwar (Dalian University of Technology) Jinye Yao (Dalian University of Technology) Yanfeng Wang (Dalian University of Technology) Haitao Ma (Dalian University of Technology) Yunpeng Wang (Dalian University of Technology)

저널정보: 대한금속·재료학회 Metals and Materials International Metals and Materials International Vol.25 No.2

발행연도: 2019.1

수록면: 499 - 507 (9page)

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In order to investigate the effect of TiO2 nanoparticles on growth behavior of interfacial Cu6Sn5 intermetallics compounds(IMCs) in Pb-free Sn/Cu system, the solder joints are fabricated by using flux doped with different content (0.0–2.0 wt% offlux) and particle diameter (5 nm and 50 nm) of TiO2 . In context of isothermal reflow soldering at 250 °C and subsequentair cooling, the increase in reflow duration from 10 to 120 s was characterized with an increment in IMC layer thicknessand grain size, due to the enhancement of Cu flux contribution for Ostwald ripening during constant temperature reflow andprecipitation kinetics during cooling. The increased proportion of TiO2 nanoparticles in flux was found to reduce the growthof IMC layer and grain size. The suppression effect on IMC was more pronounced for 5 nm particles as compared to the 50nm TiO2 . The TiO2 nanoparticles, adsorbed on IMC plane can retard the growth of the latter. Presence of sufficient amountof a given sized TiO2 nanoparticles among IMCs, by increasing the effective stress at the localized interfaces, and causingthe breaking of brittle Cu6Sn5 during growth stage; can help in the inhibition of IMC whisker formation. Particle diameterand mass proportion of TiO2 nanoparticles are important for soldering materials design.

#Shengyan Shang1 · Anil Kunwar2 · Jinye Yao1 · Yanfeng Wang1 · Haitao Ma1 · Yunpeng Wang1

참고문헌 (23)

참고문헌 신청

A. S. M. A. Haseeb / 2014 / In-situ alloying of Sn–3.5Ag solder during reflow through Zn nanoparticle addition and its effects on interfacial intermetallic layers / Intermetallics 54:86~94

M. A. A. Mohd Salleh / 2016 / Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles / Mater. Des 108:418~428

F. Xing / 2015 / Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints / J. Alloys Compd 649:1053~1059

F. Xing / 2016 / Intermetallic compounds growth suppression in ZSCB solder with RE addition on Cu substrate / J. Alloys Compd 666:122~130

Y. Huang / 2016 / Improving shear strength of Sn–3.0Ag–0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets / Mater. Lett 169:262~264

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