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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2019.1
- 수록면
- 227 - 237 (11page)
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Al 2 O 3 /Cu composite fi lms, useful for fi lm resistors, were successfully fabricated at room temperature via aerosol deposition(AD). Microstructures of the Al 2 O 3 /Cu composite fi lms were analyzed to understand the correlations between the surfacemorphologies and Al 2 O 3 /Cu ratio. A scratch test was carried out by gradually increasing the load applied to the Al 2 O 3 /Cucomposite fi lms. We also evaluated the adhesion ability by measuring the tensile strength between Al 2 O 3 /Cu composite fi lmsand Al 2 O 3 substrate. The results confi rmed that the adhesive properties of Al 2 O 3 /Cu composite fi lms were strongly infl uencedby two adhesive mechanisms: mechanical interlocking and anchoring bonds between the fi lms and Al 2 O 3 substrate. When apowder mixture containing 50 wt% of Al 2 O 3 and Cu was deposited on the substrate, high mechanical properties and suitableresistivity were simultaneously achieved at approximately 8.02 MPa and 85.2 mΩ cm, respectively due to eff ective mechanicalinterlocking and anchoring bonds. The results further suggest that room-temperature AD method is highly favorable tofabricate heterogeneous composite fi lms for application to fi lm resistors.
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참고문헌 (44)
참고문헌 신청
Bhattacharya, S.K. / 2001 / Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors / Microelectron. J 32(1):11~19
Chahal, P. / 1998 / A novel integrated decoupling capacitor for MCM-L technology / IEEE Trans. Compon. Packag. Manuf. Technol. Part B 21(2):184~193
Tummala, R.R. / 2004 / SOP: what is it and why? A new microsystemintegration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade / IEEE Trans. Adv. Packag 27(2):241~249
Bhattacharya, S. K. / 2000 / Next generation integral passives:materials, processes, and integration of resistors and capacitors on PWB substrates / J. Mater. Sci. Mater. Electron 11(3):253~268
Lin, R. C. / 2015 / A study of thin fi lm resistors prepared using Ni–Cr–Si–Al–Ta high entropy alloy / Adv. Mater. Sci. Eng 2015:1~7
Chahal, P. / 1998 / A novel integrated decoupling capacitor for MCM-L technology / IEEE Trans. Compon. Packag. Manuf. Technol. Part B 21(2):184~193
Tummala, R.R. / 2004 / SOP: what is it and why? A new microsystemintegration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade / IEEE Trans. Adv. Packag 27(2):241~249
Bhattacharya, S. K. / 2000 / Next generation integral passives:materials, processes, and integration of resistors and capacitors on PWB substrates / J. Mater. Sci. Mater. Electron 11(3):253~268
Lin, R. C. / 2015 / A study of thin fi lm resistors prepared using Ni–Cr–Si–Al–Ta high entropy alloy / Adv. Mater. Sci. Eng 2015:1~7
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