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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2019.1
- 수록면
- 247 - 252 (6page)
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The fabrication process of pure Cu fi lms on an alumina substrate using a copper complex paste was evaluated. After vigorousmilling for 7 h, copper complexes (copper(II) formate and pure Cu) with an average particle size of 312 nm were formed. A printed pattern was prepared with a paste containing the particles and a pure Cu fi lm was formed by annealing at 250 °Cfor 30 min under nitrogen atmosphere. After removing the upper part of the fi lm, a homogenous Cu fi lm with a thicknessof 424 nm was observed on the substrate. The fi lm demonstrated excellent adhesion properties and had an low electricalresistivity of 4.38 μΩ cm. Hence, the fi lm can be used as a seed for additional Cu plating.
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