Leadframe SiP with Conformal Shield

김병진; 심기동; 홍성준; 문대호; 손용호; 강대병; 김진영; 윤주훈

추천

검색

자료유형: 학술저널

저자정보: 김병진 (앰코테크놀로지 코리아 기술연구소) 심기동 (앰코코리아) 홍성준 (앰코코리아) 문대호 (앰코코리아) 손용호 (앰코코리아) 강대병 (앰코코리아) 김진영 (앰코코리아) 윤주훈 (앰코테크놀로지 코리아 기술연구소)

저널정보: 한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제23권 제4호

발행연도: 2016.12

수록면: 31 - 34 (4page)

이용수

📌

연구주제

📖

연구배경

🔬

연구방법

🏆

연구결과

초록· 키워드

오류제보하기

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

#SiP #SiP Leadframe #packaging shield #Shield ring #Backside etching

참고문헌 (4)

참고문헌 신청

S. K. Saha / 2013 / Emerging business trends in the semiconductor industry / Proc. Technology Management in the IT-Driven Services (PICMET) :2744

E. McGibney / 2006 / An overview of electrical characterization techniques and theory for IC packages and interconnects / IEEE Transactions on Advanced Packaging 29(1):131

S.-H. Hong / 1999 / Characteristics of Lead Frame Chip Scale Package (LF-CSP) / Proc. 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar :63

김병진 / 2015 / RtMLF(Routable Molded Lead Frame) 패키지 소개 및 응용 / 마이크로전자 및 패키징학회지 22(2):41~45

함께 읽어보면 좋을 논문

논문 유사도에 따라 DBpia 가 추천하는 논문입니다. 함께 보면 좋을 연관 논문을 확인해보세요!