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- 2014
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2014
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The conventional SnPb solders were widely used for several decades in the electronic packing system due to the superior mechanical properties such as low melting point, better wetability and good mechanical fatigue. However, in recent years, owing to adverse effect on the human health and environment, conventional SnPb solders have been replaced by Lead-free solders.
In order to evaluate the mechanical properties, in this research shear strength of SnAg solder alloy with Cu contents(0, 0.5wt.%) joints have been studied using the SP(share-punch) Test machine. Also, The interface of solder joints are observed to analyzed IMC(intermetallic compound) growth rate by optical microscope and scanning electron microscope(SEM). The test result about solder joints of two different plate(Cu and Ni plate) are compared. Solder alloys were carried out at high temperatures for artificial aging processing. That processing was performed at 150℃ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at 30℃ and 50℃.
Cu plate joints were generally stable in 30℃. But, maximum shear strengths of Ni plate joints were excellent as compared with Cu in 50℃. Sn-4Ag/Ni plate joints were more sensitive than Sn-4Ag-0.5Cu with increasing artificial aging time at stress-strain curve and maximum shear strength graft.
Also, Pb-free solders and Ni plate joints were excellent as compared with Sn-37Pb and Cu in high temperature in total fracture energy.
As a result, Sn-Ag-Cu solder/Ni plate joints was most excellent condition in electronic packing system in high temperature.
In order to evaluate the mechanical properties, in this research shear strength of SnAg solder alloy with Cu contents(0, 0.5wt.%) joints have been studied using the SP(share-punch) Test machine. Also, The interface of solder joints are observed to analyzed IMC(intermetallic compound) growth rate by optical microscope and scanning electron microscope(SEM). The test result about solder joints of two different plate(Cu and Ni plate) are compared. Solder alloys were carried out at high temperatures for artificial aging processing. That processing was performed at 150℃ for 0hr, 100hr, 200hr, 400hr, 600hr and 1000hr. The SP test was conducted at 30℃ and 50℃.
Cu plate joints were generally stable in 30℃. But, maximum shear strengths of Ni plate joints were excellent as compared with Cu in 50℃. Sn-4Ag/Ni plate joints were more sensitive than Sn-4Ag-0.5Cu with increasing artificial aging time at stress-strain curve and maximum shear strength graft.
Also, Pb-free solders and Ni plate joints were excellent as compared with Sn-37Pb and Cu in high temperature in total fracture energy.
As a result, Sn-Ag-Cu solder/Ni plate joints was most excellent condition in electronic packing system in high temperature.
목차
목 차 ⅰAbstract ⅲList of tables ⅴList of figures ⅵ제 1 장. 서 론 11-1. 연구배경 11-2. 국내?외 연구동향 31-2-1. 국내 연구동향 31-2-2. 국외 연구동향 51-3. 이론적 배경 71-3-1. 솔더 접합부 계면 확산이론 71-3-2. Ni기판에서 Sn 솔더의 IMC 성장 예측 121-3-3. 인공시효 시간과 전자패키징의 신뢰성 151-3-4. 인공시효 시간과 전자패키징 실제 사용시간의 상관관계 161-4. 연구목적 20제 2 장. 시험편 제작 및 실험방법 212-1. 개요 212-2. 실험재료 212-2-1. 솔더 합금 재료 212-2-2. 기판 재료 222-3. 시험편 제작 262-3-1. 솔더볼과 기판 제작 262-3-2. 솔더 접합부 제작 282-3-3. 시효처리 과정 292-4. 솔더 접합부의 IMC 거동 분석 322-4-1. 시험편 제작 322-5. 솔더 접합부의 기계적 물성평가 352-5-1. 종래 전단강도 평가방법 및 문제점 352-5-2. SP Test 실험 방법 36제 3 장. 실험결과 및 고찰 423-1. 인공시효 시간에 따른 기판과 솔더 접합부의 IMC 거동 423-1-1. 개요 423-1-2. Sn-37Pb/Cu 및 Ni 접합부의 IMC 거동 423-1-3. Sn-4Ag/Cu 및 Ni 접합부의 IMC 거동 473-1-4. Sn-4Ag-0.5Cu/Cu 및 Ni 접합부의 IMC 거동 513-2. SP Test를 통한 인공시효 시간에 따른 솔더 접합부의 전단강도 평가 563-2-1. 개요 563-2-2. Sn-37Pb/Cu 및 Ni 접합부의 전단강도 평가 563-2-3. Pb-free solder/Cu 및 Ni 접합부의 전단강도 평가 623-2-4. 솔더 접합부 파면 관찰 763-3. 인공시효 시간에 따른 솔더 접합부의 파괴에너지 평가 853-3-1. 솔더 접합부의 파괴에너지 거동 853-3-2. 솔더 접합부의 총 파괴에너지 거동 91제 4 장. 결론 93참고문헌 96
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