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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- Korean Society for Precision Engineering Journal of the Korean Society for Precision Engineering 한국정밀공학회지 Vol.31 No.9
- 발행연도
- 2014.9
- 수록면
- 831 - 838 (8page)
이용수
초록· 키워드
오류제보하기
Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.
목차
1. 서론
2. 실험장치
3. 결과
4. 결론
REFERENCES
참고문헌 (12)
참고문헌 신청
Kristiansen, H. / 1998 / Overview of Conductive Adhesive Interconnection Technologies for LCDs / IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 21(2):208~214
Kwon, S. H. / 2008 / The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface / J. Korean Soc. Precis. Eng 25(6):7~12
Kim, J. W. / 2006 / Effects of Bonding Pressure on the Thermo-Mechanical Reliability of ACF Interconnection / Microelectronic Engineering 83(11-12):2335~2340
Kwon, W.-S. / 2006 / Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection / IEEE Transactions on Components and Packaging Technologies 29(3):528~534
Yim, M. J. / 2007 / Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Chip-on-Glass (COG) Applications / International Journal of Adhesion and Adhesives 27(1):77~84
Kwon, S. H. / 2008 / The Experimental Validation for the Optimization of Heating Tool Head for Minimized Temperature Distribution on Bonding Surface / J. Korean Soc. Precis. Eng 25(6):7~12
Kim, J. W. / 2006 / Effects of Bonding Pressure on the Thermo-Mechanical Reliability of ACF Interconnection / Microelectronic Engineering 83(11-12):2335~2340
Kwon, W.-S. / 2006 / Experimental Analysis of Mechanical and Electrical Characteristics of Metal-Coated Conductive Spheres for Anisotropic Conductive Adhesives (ACAs) Interconnection / IEEE Transactions on Components and Packaging Technologies 29(3):528~534
Yim, M. J. / 2007 / Anisotropic Conductive Films (ACFs) for Ultra-Fine Pitch Chip-on-Glass (COG) Applications / International Journal of Adhesion and Adhesives 27(1):77~84
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