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Finite Element Analysis of ACF Ultrasonic Chip-on Glass(COG) Bonding
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Type
Proceeding
Author
Journal
The Korean Welding & Joining Society 대한용접학회 특별강연 및 학술발표대회 개요집 Vol.50
Published
2008.11
Pages
170 - 170 (1page)

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Finite Element Analysis of ACF Ultrasonic Chip-on Glass(COG) Bonding
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#Ultrasonic Bonding #Anisotropic Conductive Adhesive (ACF) #Chip on Glass #Chip on Film #LCD #Finite Element Analysis #ABAQUS

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