지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2020.7
- 수록면
- 408 - 415 (8page)
이용수
초록· 키워드
오류제보하기
Purpose : In a general case, the life test could designed based on the failure mode and mechanism of components and materials or field failure cases. However, it is difficult to predict which components or parts could cause failure of an assembly in case of a new developed product or assembly that combined many different components and materials. Therefore, in this paper we studied the life test for the new developed assembly A that combined many electronic components.
Methods : It is important for the life test design to choose an effective stress of the assembly A. The effective stress factor selecting is most important especially when we could not know the failure mode and mechanism. In this paper, the effects of every possible stresses were analysed using QFD(Quality Function Deployment) method. Temperature difference between ground and high altitude was found as the effective stress of the assembly A. To accelerate temperature difference we designed the life test that accelerated the life cycle.
Result : The life test was designed for the new developed assembly A and the failure were found in every samples at the similar test step. Samples were three. The fault was not occurred the specific component but the connect part that connect between two circuit cards. We predicted the MCBF(Mean Cycle Between Failure) of the assembly A using every samples’ failure cycles based on a statistical analysis.
Conclusion : In this paper the life test design was analysed and done for the assembly A which combined many electronic components. It is difficult to generalized the life test method for new developed assemblies. Therefore, from the beginning of various life test analyses are necessary to distinguish factors that affect the lifetime.
Methods : It is important for the life test design to choose an effective stress of the assembly A. The effective stress factor selecting is most important especially when we could not know the failure mode and mechanism. In this paper, the effects of every possible stresses were analysed using QFD(Quality Function Deployment) method. Temperature difference between ground and high altitude was found as the effective stress of the assembly A. To accelerate temperature difference we designed the life test that accelerated the life cycle.
Result : The life test was designed for the new developed assembly A and the failure were found in every samples at the similar test step. Samples were three. The fault was not occurred the specific component but the connect part that connect between two circuit cards. We predicted the MCBF(Mean Cycle Between Failure) of the assembly A using every samples’ failure cycles based on a statistical analysis.
Conclusion : In this paper the life test design was analysed and done for the assembly A which combined many electronic components. It is difficult to generalized the life test method for new developed assemblies. Therefore, from the beginning of various life test analyses are necessary to distinguish factors that affect the lifetime.
목차
1. 서론
2. 조립체A 수명시험 설계
3. 결론
References
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UCI(KEPA) : I410-ECN-0101-2020-323-000884182