The evolution of microstructure and resistance in electroplated copper films by linear integrated laser scanning annealing

Lingyue Tan; Silin Han; Shuhui Chen; Tao Hang; Huiqin Ling; Yunwen Wu; Ming Li

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자료유형: 학술저널

저자정보: Lingyue Tan (Shanghai Jiao Tong University) Silin Han (Shanghai Jiao Tong University) Shuhui Chen (Shanghai Jiao Tong University) Tao Hang (Shanghai Jiao Tong University) Huiqin Ling (Shanghai Jiao Tong University) Yunwen Wu (Shanghai Jiao Tong University) Ming Li (Shanghai Jiao Tong University)

저널정보: 대한금속·재료학회 Electronic Materials Letters Electronic Materials Letters Vol.17 No.2

발행연도: 2021.1

수록면: 207 - 214 (8page)

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Thermal treatment is an effective way to decrease the resistivity and internal stress by inducing grain growth accompaniedwith redistribution of embedded impurities. With the narrowing of Cu interconnects in IC packaging, the increased resistanceis becoming the main issue that hindering the electrical performance of IC. Herein, a laser annealing method by linerscanning (LALS) to anneal the Cu interconnects were reported which provide a gradient thermal field for the crystallographic/microstructure transition. The impacts of laser annealing on the sheet resistance of the electroplating Cu films wereinvestigated in aspects of microstructure and phase field simulation. Cu films treated by LALS owned larger average grainsize, better recrystallization fraction, and significantly higher average grain aspect ratio than conventional annealing, whichindicated the increased driving force for grain boundaries evolution by LALS method. This study exhibited the direct evidenceon the impacts of laser annealing process on the resistance of electroplated Cu films. The laser annealing process witha local temperature gradient caused a significant decline in Cu electrical resistance compared to the conventional annealingprocess, indicating its extraordinary potential in improving Cu wire conductivity. This work will provide a scientific basis forselecting the post-treatment process for electrodeposited Cu films to achieve ideal electrical properties and microstructurein electronics industry applications.

#Laser annealing · Liner scanning · Cu interconnect · Phase field simulation

참고문헌 (26)

참고문헌 신청

Debajit Bhattacharya / 2016 / Ultra-High Density Monolithic 3-D FinFET SRAM With Enhanced Read Stability / IEEE Transactions on Circuits and Systems I: Regular Papers 63(8):1176~1187

Feng, X. / 2016 / Experimental and theoretical study on self-annealing behavior of copper fi lm electroplated with 2-mercaptopyridine and 2-aminobenzothiazole as additives / J. Electrochem. Soc 163(2):D57~D62

Susan L. Burkett / 2020 / Tutorial on forming through-silicon vias / Journal of Vacuum Science & Technology A 38(3):031202

Gupta, T. / 2010 / Copper Interconnect Technology / Springer

Zhang, Z. Y. / 2019 / Competitive eff ect of leveler’s electrochemical behavior and impurity on electrical resistance of electroplated copper / J. Electrochem. Soc 166(13):D577~D582

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