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This paper describes recently developed enhancements for modeling the damage build-up and the enhanced dechanneling process of ion motion in 3D Monte Carlo (MC) TRICSI (TRansport Ions into Crystal Silicon) computer simulation code for ion implantation into (100) silicon wafer. Our phenomenological modeling has been focused on the interdependence of dynamic channeling process and damage build-up, the electronic energy loss over commonly used energy range, and the computationally efficient 3D simulation on a wide implanted window area by comparison with 1D and 2D simulations. Our statistical and physically based model assumes the accumulation of point defects and amorphous pockets or highly disordered regions for damage grown-up, including the in situ annealing process during implantation. Our results for phosphorus- and silicon-implanted range have been verified by comparison with the published SIMS experiments over commonly used energy range from 15 to 180 keV, and dose range of up to 1 x 10^(16)/㎠. For the defect distribution, we compared the thickness of amorphized layer and the damage profile from the recent RBS experiments [S. Tian, Monte Carlo simulation of ion implantation damage process in silicon: arsenic, phosphorus. silicon, BF₂, and Boron implants, Ph. D. Thesis, The University of Texas at Austin, 1997]. By comparing to his data, we achieved reasonable agreements with RBS experiments.

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Abstract

Ⅰ. Introduction

Ⅱ. General Information of TRICSI code

Ⅲ. Empirical Electronic Stopping Model and Parameterization for Phosphorus and Silicon Self Implants

Ⅳ. Enhancements of 3D Dynamic Damage Accumulation Model

Ⅴ. Simulation Results and Discussions

Ⅵ. Conclusions

References

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UCI(KEPA) : I410-ECN-0101-2009-569-017769856