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Several oxides have recently been reported to have resistance-switching characteristics for nonvolatile memory (NVM) applications. Both binary and ternary oxides demonstrated great potential as resistive-switching memory elements. However, the switching mechanisms have not yet been clearly understood, and the uniformity and reproducibility of devices have not been sufficient for gigabit-NVM applications. The primary requirements for oxides in memory applications are scalability, fast switching speed, good memory retention, a reasonable resistive window, and constant working voltage. In this paper, we discuss several materials that are resistive-switching elements and also focus on their switching mechanisms. We evaluated non-stoichiometric polycrystalline oxides (Nb₂O<SUB>5</SUB>, and ZrO<SUB>x</SUB>) and subsequently the resistive switching of CU<SUB>x</SUB>O and heavily Cu-doped MoO<SUB>x</SUB> film for their compatibility with modern transistor-process cycles. Single-crystalline Nb-doped SrTiO₃(NbSTO) was also investigated, and we found a Pt/single-crystal NbSTO Schottky junction had excellent memory characteristics. Epitaxial NbSTO film was grown on an Si substrate using conducting TiN as a buffer layer to introduce single-crystal NbSTO into the CMOS process and preserve its excellent electrical characteristics.

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Abstract
Ⅰ. INTRODUCTION
Ⅱ. RESISTIVE SWITCHING OF BIMARY OXIDES
Ⅲ. RESISTIVE SWITCHING OF CU-AND MO-BASED OXIDES
Ⅳ. RESISTIVE SWITCHING OF SINGLE CRYSTAL AND EPITAXIAL SAMPLES
Ⅴ. SUMMARY
ACKNOWLEDGMENTS
REFERENCES

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UCI(KEPA) : I410-ECN-0101-2010-569-001438510