Bonding Characteristics of Anisotropic Conductive Film (ACF) by Lateral Thermosonic Bonding Technology for Flip Chip Interconnection

C.W. Ha ,  T.Y. Jang ,  W.S. Yun and others 1

한국정밀공학회 학술발표대회 논문집

2009 .06

Finite Element Analysis for ACF Low Temperature Thermosonic Bonding Process

Yong Song ,  Sung-Ho Jeon ,  Young-Eui Shin and others 2

대한용접학회 특별강연 및 학술발표대회 개요집

2009 .11

Reliable Bonding for Lateral Thermosonic Bonding Process with Elasticity of ACF

C.W. Ha ,  K.R. Kim ,  W.S. Yun and others 3

한국정밀공학회 학술발표대회 논문집

2010 .05

ACF COB Bonding Process using Thermosonic

Yong Song ,  Byung-Seung Yim ,  Jin-Sik Joung and others 1

Journal of Welding and Joining

2011 .02

Lateral Thermosonic Interconnection with Elasticity of ACF

C. W. Ha ,  W. S. Yun ,  K. S. Pa and others 2

한국정밀공학회 학술발표대회 논문집

2009 .10

ACF Thermo-sonic Chip-on-Glass(COG) Bonding

Sung-Ho Jeon ,  Byung-Seung Yim ,  Sun-Beung Lee and others 4

대한용접학회 특별강연 및 학술발표대회 개요집

2008 .11

Optimization of Process Condition for Flip-Chip Bonding Process using Anisotropic Conductive Film(ACF)

H. W. Kang ,  Y. J. Choi ,  S. H. Nam and others 2

한국정밀공학회 학술발표대회 논문집

2008 .06

Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology

Chang-Wan Ha ,  Won-Soo Yun ,  Keum-Saeng Pa and others 2

Journal of the Korean Society for Precision Engineering

2010 .07

FLIP Chip Bonding Character Using ACF Bonding Process

Y. J. Choi ,  K. M. Kim ,  K. Y. Ryu and others 2

한국정밀공학회 학술발표대회 논문집

2007 .06

The method for ACF　Bonding Reliability and Accuracy

Keum Saeng Pa ,  k

한국정밀공학회 학술발표대회 논문집

2006 .10

Finite element analysis for ACF Ultrasonic bonding

Y. Song ,  B. S. Yim ,  S. H. Jeon and others 2

한국정밀공학회 학술발표대회 논문집

2009 .06

ACF COB(Chip-on-Board) Bonding Using Thermosonic

Y. Song ,  B. S. Yim ,  J. S. Joung and others 1

한국정밀공학회 학술발표대회 논문집

2010 .11

An Analysts of the ACF Bonding Characteristic depending on the FLIP CHIP Size

Y. J. Choi ,  K. M. Kim ,  B. Y. Choi and others 2

한국정밀공학회 학술발표대회 논문집

2008 .06

Interconnection Characteristics of Thermosonic Flip Chip Bonding Using Anisotropic conductive Film

Sung-Ho Jeon ,  Yong Song ,  Hyun Seok Chung and others 3

대한용접학회 특별강연 및 학술발표대회 개요집

2009 .11

Analysis on the Electrical Resistance Characteristic of FLIP CHIP Bonded Junction using ACF Flim

Y. J. Choi ,  S. W. Lee ,  H. Z. Choi and others 2

한국정밀공학회 학술발표대회 논문집

2007 .11

Finite Element Analysis of ACF Ultrasonic Chip-on Glass(COG) Bonding

Sun-Beung Lee ,  Young-Eui Shin ,  Seong-Hyuk Lee and others 1

대한용접학회 특별강연 및 학술발표대회 개요집

2008 .11

Thermosonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)

Jin Suk Pa ,  k ,  Sung Ho Jeon and others 5

한국표면공학회 학술발표회 초록집

2008 .06

ACF 2016 (The 7th International Conference of Asian Concrete Federation)

Se-Jin Jeon

Magazine of the Korea Concrete Institute

2017 .01

Chip on Film Interconnection using Lateral Thermosonic Bonding Technology

C.-W. Ha ,  K.-R. Kim ,  W.-S. Yun and others 2

한국정밀공학회 학술발표대회 논문집

2011 .06

Flexible temperature sensor bonding using ACF technology for fabrication of smart band module

J. S. Pa ,  k ,  D. S. Kim and others 9

한국생산제조학회 학술발표대회 논문집

2017 .12