고온동작소자의 패키징을 위한 천이액상확산접합 기술

정도현; 노명환; 이준형; 김경흠; 정재필

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자료유형: 학술저널

저자정보: 정도현 노명환 이준형 김경흠 정재필

저널정보: 한국마이크로전자및패키징학회 마이크로전자 및 패키징학회지 마이크로전자 및 패키징학회지 제24권 제1호

발행연도: 2017.1

수록면: 17 - 25 (9page)

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Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

#power module #power semiconductor #transient liquid phase #TLP) bonding #Pb-free solder #High temperature operation

참고문헌 (25)

참고문헌 신청

H. Chin / 2010 / A Review on Die Attach Materials for SiC-Based High-Temperature Power Device / Metallurgical and Materials Transactions B 41 (4) : 824 ~

H. Greve / 2014 / Reliability of paste based transient liquid phase sintered interconnects / 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando, FL 1314

H. S. Chin / 2010 / A Review on Die Attach Materials for SiC-Based High-Temperature Power Device / Metallurgical and Materials Transactions B 41 (4) : 824 ~

J. Millan / 2012 / A Review of WBG Power Semiconductor Devices / 2012 International semiconductor Conference (CAS) 57

J. P. Jung / 1993 / A study on the Melting Induced Diffusion Bonding of 304 stainless steel / J. of the Korean Inst. of Met. & Mater 31 (3) : 323 ~

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