지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.20 No.1
- 발행연도
- 2020.2
- 수록면
- 84 - 92 (9page)
- DOI
- 10.5573/JSTS.2020.20.1.084
이용수
초록· 키워드
오류제보하기
For the temperature regulation in a rapid thermal processing system in semiconductor manufacturing, we develop an adaptive iterative learning controller based on the finite-element-method in this paper. A finite-dimensional model of the system is constructed by the finite-element-method firstly. Then, adaptive iterative learning controller is designed based on the finite-dimensional model. Simulations are performed by heating the wafer in the system with the developed control method. Simulation results show the effectiveness of the proposed adaptive iterative learning controller.
목차
Abstract
I. INTRODUCTION
II. MODEL FORMULATION
III. FINITE-DIMENSIONAL MODEL
IV. ADAPTIVE LEARNING CONTROL METHOD
V. SIMULATION
VI. CONCLUSION
REFERENCES
참고문헌 (14)
참고문헌 신청
S. Lin and H. S. Chu, “Thermal uniformity of 12-in silicon wafer during rapid thermal processing by inverse heat transfer method,” IEEE Transactions on Semiconductor Manufacturing, vol. 13, no. 4, pp. 448-456, 2000
P. Vandenabeele, K. Maex, and R. De Keersmaecker, “Impact of patterned layers on temperature non-uniformity during rapid thermal processing for vlsi-applications,” in Symposium B Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing, ser. MRS Proceedings, vol. 146, 1 1989.
K. S. Lee, J. Lee, I. Chin, J. Choi, and J. H. Lee, “Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique,” Industrial & Engineering Chemistry Research, vol. 40, no. 7, pp. 1661-1672, 2001.
R. S. Gyurcsik, T. J. Riley, and F. Y. Sorrell, “A model for rapid thermal-processing - achieving uniformity through lamp control,” IEEE Transactions on Semiconductor Manufacturing, vol. 4, no. 1, pp. 9-13, 1991.
S. Chatterjee, I. Trachtenberg, and T. F. Edgar, “Mathematical-modeling of a single-wafer rapid thermal reactor,” Journal of the Electrochemical Society, vol. 139, no. 12, pp. 3682-3689, 1992.
P. Vandenabeele, K. Maex, and R. De Keersmaecker, “Impact of patterned layers on temperature non-uniformity during rapid thermal processing for vlsi-applications,” in Symposium B Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing, ser. MRS Proceedings, vol. 146, 1 1989.
K. S. Lee, J. Lee, I. Chin, J. Choi, and J. H. Lee, “Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique,” Industrial & Engineering Chemistry Research, vol. 40, no. 7, pp. 1661-1672, 2001.
R. S. Gyurcsik, T. J. Riley, and F. Y. Sorrell, “A model for rapid thermal-processing - achieving uniformity through lamp control,” IEEE Transactions on Semiconductor Manufacturing, vol. 4, no. 1, pp. 9-13, 1991.
S. Chatterjee, I. Trachtenberg, and T. F. Edgar, “Mathematical-modeling of a single-wafer rapid thermal reactor,” Journal of the Electrochemical Society, vol. 139, no. 12, pp. 3682-3689, 1992.
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