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장기생태연구 인프라 구축 동향
한국정보과학회 학술발표논문집
2015 .06
장기생태연구시스템의 개인정보 보호 연구
대한산업공학회 춘계공동학술대회 논문집
2016 .04
KNLTER Data Platform Enabling Global Data Exchange By Means of Full Life-cycle Data Management
INTERNATIONAL CONFERENCE ON FUTURE INFORMATION & COMMUNICATION ENGINEERING
2017 .06
Design and Integration of Planar Inductances on PCB Application Passive Type Filters
Transactions on Electrical and Electronic Materials
2020 .01
5G 주파수 대역에서의 실내 복도 전파 경로손실 측정 및 분석
한국정보통신학회논문지
2022 .05
Spectroscopic Analysis of Film Stress Mechanism in PECVD Silicon Nitride
Transactions on Electrical and Electronic Materials
2018 .02
n -Type Conductivity of Cu 2 O Thin Film Prepared in Basic Aqueous Solution Under Hydrothermal Conditions
Electronic Materials Letters
2018 .01
다층 PCB에서 Microstrip to Microstrip Via Transition을 적용한 K-Band 단일 패치 안테나 연구
한국통신학회 학술대회논문집
2023 .06
Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films
Electronic Materials Letters
2024 .09
Adhesive Mechanism of Al2O3/Cu Composite Film via Aerosol Deposition Process for Application of Film Resistor
Electronic Materials Letters
2019 .01
Characterization of Copper Complex Paste: Manufacture of Thin Cu‑Seed Films on Alumina Substrates
Electronic Materials Letters
2019 .01
Electrical Properties of a ZTO Thin‑Film Transistor Prepared with Near‑Field Electrohydrodynamic Jet Spraying
Electronic Materials Letters
2019 .01
배전자동화 중앙장치에서 필터링 알고리즘을 통한 고장표시 오류 개선방법
전기학회논문지
2015 .10
Incorporation of ZnO Nanoparticles on Solution Processed Zinc Oxide Thin-Film Transistors
Transactions on Electrical and Electronic Materials
2018 .12
고조파 억제를 위한 IoT 센서용 소형 마이크로스트립 패치 안테나
한국산학기술학회 논문지
2017 .06
Enhanced Hall mobility and d0 ferromagnetism in Li-doped ZnO thin films prepared by aerosol-assisted CVD
Electronic Materials Letters
2024 .03
Simulation-Based Fault Analysis for Resilient System-On-Chip Design
Journal of information and communication convergence engineering
2021 .09
Near-Ultraviolet Lateral Photovoltaic Effect of Epitaxial Nb:SrTiO3 Films on Si Substrate Using TiN as a Buffer Layer
Electronic Materials Letters
2024 .05
Study of Laser Lift-Off Process for Fabrication of GaN-Based 365-nm Ultraviolet Absorption Layer Removed Flip Chip LED
Transactions on Electrical and Electronic Materials
2018 .06
Review on Various Memristor Models, Characteristics, Potential Applications, and Future Works
Transactions on Electrical and Electronic Materials
2019 .01
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