메뉴 건너뛰기
Library Notice
Institutional Access
If you certify, you can access the articles for free.
Check out your institutions.
ex)Hankuk University, Nuri Motors
Log in Register Help KOR
Subject

Wafer Map Image Analysis Methods in Semiconductor Manufacturing System
Recommendations
Search
Questions

반도체 공정에서의 Wafer Map Image 분석 방법론

논문 기본 정보

Type
Academic journal
Author
Youngji Yoo (고려대학교) Daewoong An (SK 하이닉스) Seung Hwan Park (고려대학교) Jun-Geol Baek (고려대학교)
Journal
Korean Institute Of Industrial Engineers Journal of the Korean Institute of Industrial Engineers Vol.41 No.3 KCI Excellent Accredited Journal
Published
2015.6
Pages
267 - 274 (8page)

Usage

cover
📌
Topic
📖
Background
🔬
Method
🏆
Result
Wafer Map Image Analysis Methods in Semiconductor Manufacturing System
Ask AI
Recommendations
Search
Questions

Abstract· Keywords

Report Errors
In the semiconductor manufacturing post-FAB process, predicting a package test result accurately in the wafer testing phase is a key element to ensure the competitiveness of companies. The prediction of package test can reduce unnecessary inspection time and expense. However, an analysing method is not sufficient to analyze data collected at wafer testing phase. Therefore, many companies have been using a summary information such as a mean, weighted sum and variance, and the summarized data reduces a prediction accuracy. In the paper, we propose an analysis method for Wafer Map Image collected at wafer testing process and conduct an experiment using real data.

Contents

1. 서론
2. Wafer Map Image 분석 방법론
3. Wafer Map Image Data 분석
4. 결론
참고문헌

References (17)

Add References

Recommendations

It is an article recommended by DBpia according to the article similarity. Check out the related articles!

Related Authors

Frequently Viewed Together

Recently viewed articles

Comments(0)

0

Write first comments.

UCI(KEPA) : I410-ECN-0101-2016-530-001527953