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논문 기본 정보

자료유형
학술저널
저자정보
Hara Kang (Kookmin University) Jun Tae Jang (Kookmin University) Jonghwa Kim (Kookmin University) Sung-Jin Choi (Kookmin University) Dong Myong Kim (Kookmin University) Dae Hwan Kim (Kookmin University)
저널정보
대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.15 No.5
발행연도
2015.10
수록면
519 - 525 (7page)

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초록· 키워드

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Positive bias stress-induced instability in amorphous indium-gallium-zinc-oxide (a-IGZO) bottom-gate thin-film transistors (TFTs) was investigated under high VGS/low VDS and low VGS/high VDS stress conditions through incorporating a forward/reverse VGS sweep and a low/high VDS readout conditions. Our results showed that the electron trapping into the gate insulator dominantly occurs when high VGS/low VDS stress is applied. On the other hand, when low VGS/high VDS stress is applied, it was found that holes are uniformly trapped into the etch stopper and electrons are locally trapped into the gate insulator simultaneously. During a recovery after the high VGS/low VDS stress, the trapped electrons were detrapped from the gate insulator. In the case of recovery after the low VGS/high VDS stress, it was observed that the electrons in the gate insulator diffuse to a direction toward the source electrode and the holes were detrapped to out of the etch stopper. Also, we found that the potential profile in the a-IGZO bottom-gate TFT becomes complicatedly modulated during the positive VGS/VDS stress and the recovery causing various threshold voltages and subthreshold swings under various read-out conditions, and this modulation needs to be fully considered in the design of oxide TFT-based active matrix organic light emitting diode display backplane.

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Abstract
Ⅰ. INTRODUCTION
Ⅱ. DEVICE STRUCTURE, ELECTRICAL CHARACTERISTICS, AND MEASUREMENT SETUP
Ⅲ. RESULT & DISCUSSION
Ⅳ. TCAD SIMULATION
Ⅴ. CONCLUSIONS
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UCI(KEPA) : I410-ECN-0101-2016-569-002082805